SRI KRISHNA COLLEGE OF ENGINEERING AND TECHNOLOGY

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101.
IEEE TRANSACTIONS ON SOFTWARE ENGINEERING
Material type: Text Text
Publication details: NEW YORK IEEE COMPUTER SOCEITY 2001
Availability: Items available for loan: Sri Krishna College of Engineering and Technology (1).

102.
IEEE POWER ENGINEERING REVIEW
Material type: Text Text
Publication details: NEW YORK IEEE COMPUTER SOCEITY 2001
Availability: Items available for loan: Sri Krishna College of Engineering and Technology (1).

103.
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION VLSI SYSTEMS
Material type: Text Text
Publication details: NEW YORK IEEE COMPUTER SOCIETY 2001
Availability: Items available for loan: Sri Krishna College of Engineering and Technology (1).

104.
IEEE POWER ENGINEERING REVIEW
Material type: Text Text
Publication details: NEW YORK IEEE COMPUTER SOCIETY 2000
Availability: Items available for loan: Sri Krishna College of Engineering and Technology (1).

105.
IEEE COMMUNICATIONS
Material type: Text Text
Publication details: NEW YORK IEEE COMMUNICATIONS SOCIETY 2001
Availability: Items available for loan: Sri Krishna College of Engineering and Technology (1).

106.
IEEE CONTROL SYSTEMS
Material type: Text Text
Publication details: NEW YORK IEEE 2000
Availability: Items available for loan: Sri Krishna College of Engineering and Technology (1).

107.
IEEE INTELLIGENT SYSTEMS
Material type: Text Text
Publication details: NEW YORK IEEE 2001
Availability: Items available for loan: Sri Krishna College of Engineering and Technology (1).

108.
TODAYS ENGINEER
Material type: Text Text
Publication details: NEW YORK IEEE 2000
Availability: Items available for loan: Sri Krishna College of Engineering and Technology (1).

109.
IEEE SPECTRUM
Material type: Text Text
Publication details: NEW YORK IEEE 2001
Availability: Items available for loan: Sri Krishna College of Engineering and Technology (1).

110.
IEEE ROBOTICS AND AUTOMATION
Material type: Text Text
Publication details: NEW YORK IEEE 2000
Availability: Items available for loan: Sri Krishna College of Engineering and Technology (1).

111.
IEEE ELECTRICAL INSULATION
Material type: Text Text
Publication details: NEW YORK IEEE 2000
Availability: Items available for loan: Sri Krishna College of Engineering and Technology (1).

112.
IEEE POTENTIALS
Material type: Text Text
Publication details: NEW YORK IEEE 2001
Availability: Items available for loan: Sri Krishna College of Engineering and Technology (1).

113.
IEEE SOFTWARE
Material type: Text Text
Publication details: NEW YORK IEEE 2001
Availability: Items available for loan: Sri Krishna College of Engineering and Technology (1).

114.
IEEE TRANSACTIONS ON COMPUTERS
Material type: Text Text
Publication details: NEW YORK IEEE COMPUTER SOCIETY 2000
Availability: Items available for loan: Sri Krishna College of Engineering and Technology (1).

115.
IEEE ENGINEERING IN MEDICINE AND BIOLOGY
Material type: Text Text
Publication details: NEW YORK IEEE 2000
Availability: Items available for loan: Sri Krishna College of Engineering and Technology (1).

116.
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION VLSI SYSTEMS
Material type: Text Text
Publication details: NEW YORK IEEE 2000
Availability: Items available for loan: Sri Krishna College of Engineering and Technology (1).

117.
IEEE COMPUTER APPLICATIONS IN POWER
Material type: Text Text
Publication details: NEW YORK IEEE 2000
Availability: Items available for loan: Sri Krishna College of Engineering and Technology (1).

118.
IEEE ASME TRANSACTIONS ON MECHATRONICS
Material type: Text Text
Publication details: NEW YORK IEEE 2000
Availability: Items available for loan: Sri Krishna College of Engineering and Technology (1).

119.
IEEE INTERNET COMPUTING
Material type: Text Text
Publication details: NEW YORK IEEE 2000
Availability: Items available for loan: Sri Krishna College of Engineering and Technology (1).

120.
IEEE/ASME TRANSACTIONS ON MEECHATORNICS
Material type: Text Text
Publication details: NEWYORK IEEE 2001
Availability: Items available for loan: Sri Krishna College of Engineering and Technology (1).

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