END USERS GUIDE TO INNOVATIVE FLEXIBLE CIRCUIT PACKAGING
Material type: TextLanguage: ENGLISH Publication details: MCGRAW HILL BOOK COMPANY; 1996Description: 153ISBN:- 0824775848
- 621.38174
- JAY
Item type | Current library | Call number | Materials specified | Status | Notes | Date due | Barcode |
---|---|---|---|---|---|---|---|
Reference Books | Sri Krishna College of Engineering and Technology REF RACK 4 / SHELF 92 | 621.38174 (Browse shelf(Opens below)) | Available | ECE | 3907 |
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621.381535 CLA OPERATIONAL AMPLIFIERS | 621.3815364 BES PHASE-LOCKED LOOPS : DESIGN, SIMULATION, AND APPLICATIONS | 621.38173 M6 WAFER SCALE INTEGRATION | 621.38174 END USERS GUIDE TO INNOVATIVE FLEXIBLE CIRCUIT PACKAGING | 621.38174 BLA SURFACE-MOUNT TECHNOLOGY FOR PC BOARDS | 621.38174 M 6 DIGITAL PRINTED CIRCUIT DESIGN AND DRAFTING | 621.38174 N3 SURFACE MOUNT TECHNOLOGY |
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